SumiDIA WD Blanks

• Sumitomo has recently introduced a new "high density" PCD wire die blank. These new die blanks contain more diamond and less metal catalyst resulting in a PCD material which has a significantly higher abrasion resistance.

• There are three new series of blanks and all are available with 1, 3, 5,12 and 25 micron diamond.

  • WD700 series is free standing cylinder of PCD diamond (no carbide support ring).
  • WD800 series is the same as the WD700 series but it has been made thermally stable to 1,000°C. This is important when mounting the die blank with high temperature brazing alloy or drawing wire in a high temperature condition.
  • WD900 series is a PCD cylinder with a tungsten carbide support ring.

SumiDIA WD Wire Die Blanks (High Density PCD)
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*ADDMA No.
Product No.
Diamond Micron Size (A.P.S.)
Nominal Dimensions (mm)
Grain Size
Diamond Diameter (d)
Diamond Thickness (t)
1
5
12
25
D-6
WD705
F
M
C
E
2.5
1.0
D-12
WD710
F
M
C
E
3.2
1.5
D-15
WD715
F
M
C
E
5.2
2.5
D-18
WD720
F
M
C
E
5.2
3.5
D-6
WD805
F
M
C
E
2.5
1.0
D-12
WD810
F
M
C
E
3.2
1.5
D-15
WD815
F
M
C
E
5.2
2.5
D-18
WD820
F
M
C
E
5.2
3.5

SumiDIA WD Wire Die Blanks (High Density PCD)

*ADDMA No.
Product No.
Diamond Micron Size (A.P.S.)
Nominal Dimensions (mm)
Grain Size
Diamond Diameter (d)
Diamond Thickness (t)
Blank
Diameter (D)
1
3
5
12
25
D-12
WD910
F
S
M
C
E
1.5
1.5
4.0
D-15
WD915
F
S
M
C
E
4.0
2.3
8.12
D-18
WD920
F
S
M
C
E
4.0
2.9
8.12
D-21
WD925
  
S
M
C
E
7.0
4.0
13.65
D-24
WD930
  
S
M
C
E
7.0
5.3
13.65
D-27
WD940
    
M
C
E
8.7
7.5
14.5
D-27
WD945
    
M
C
E
13.0
9.0
24.13
D-30
WD950
    
M
C
E
13.0
12.0
24.13
D-33
WD960
      
C
E
16.0
16.0
24.13
D-36
WD970
        
E
19.0
19.0
35.0
-
WD975
        
E
25.0
20.0
42.0
-
WD980
        
E
30.0
22.0
47.0
-
WD990
        
E
40.0
25.0
67.0
-
WD995
        
E
45.0
27.0
67.0

*American Diamond Die Manufacturers Association

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